Patent Assignment
Reel/Frame 020369/0294
Assignment of Assignor's Interest
Recorded: 2008-01-16
Pages: 4
Assignee
OC OERLIKON BALZERS AG
IRAMALI 18, P.O. BOX 1000, BALZERS, 9496, LIECHTENSTEIN
Covered Property
(1)
Rf Substrate Bias with High Power Impulse Magnetron Sputtering (Hipims)
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 17, 2014
From: OC OERLIKON BALZERS AG
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 031990/0679 →
Assignment of Assignor's Interest
Jan 20, 2014
From: OC OERLIKON BALZERS AG
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 032001/0531 →
Assignment of Assignor's Interest
Mar 12, 2019
From: EVATEC ADVANCED TECHNOLOGIES AG (FORMALLY KNOWN AS OERLIKON ADVANCED TECHNOLOGIES AG)
To: EVATEC AG
Reel/Frame 048566/0808 →