IP Library › Assignment 020389/0045
Patent Assignment
Reel/Frame 020389/0045

Assignment of Assignor's Interest

Recorded: 2008-01-10 Pages: 2
Assignors
LEE, YOUNG IL
Executed: 2007-12-11
JOUNG, JAE WOO
Executed: 2007-12-11
CHOI, JOON RAK
Executed: 2007-12-11
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method of Manufacturing Light Emitting Diode Package
Patent: 7,795,055 →
Application: 12/007,417 →
Publication: US 2009/0286337
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →