Method of manufacturing light emitting diode package
View Patent ↗There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.
1. A method of manufacturing a light emitting diode chip, the method comprising:
providing a light emitting diode chip;
forming a phosphor layer on a top of the light emitting diode chip; and
forming phosphors of a lattice structure including an uneven surface on the phosphor layer by an inkjet process using an ink containing phosphor powder.
2. The method of claim 1 , wherein the phosphor layer is attached on the top of the light emitting diode chip,
wherein the method further comprises:
mounting the light emitting diode chip having the phosphor layer attached on the top thereof in a housing; and
molding an inner portion of the package housing with a transparent resin.
3. The method of claim 1 , wherein the providing a light emitting diode chip comprises:
mounting the light emitting diode chip in the package housing; and
molding an inner portion of the package housing with a transparent resin,
wherein the phosphor layer is formed on a top of the transparent resin.
4. The method of claim 1 , wherein the phosphors of the lattice structure are arranged in a plurality of dots.
5. The method of claim 1 , wherein the phosphors of the lattice structure have a refractivity greater than a refractivity of the phosphor layer.
6. A method of manufacturing a light emitting diode package, the method comprising:
forming a phosphor layer with a predetermined thickness;
forming phosphors of a lattice structure including an uneven surface on the phosphor layer by an ink jet process using an ink containing phosphor powder; and
disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of a light emitting diode chip.
7. The method of claim 6 , wherein the disposing the phosphor layer comprises:
attaching the phosphor layer having the phosphors of the lattice structure formed thereon on the top of the light emitting diode chip;
mounting the light emitting diode chip having the phosphor layer attached thereon in a package housing; and
molding an inner portion of the package housing with a transparent resin.
8. The method of claim 6 , wherein the disposing the phosphor layer comprises:
mounting the light emitting diode chip in the package housing;
molding an inner portion of the package housing with a transparent resin; and
attaching the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the transparent resin.
9. The method of claim 6 , wherein the phosphors of the lattice structure are formed on a sheet of the phosphor layer,
wherein the method further comprises:
cutting the sheet of the phosphor layer having the phosphors of the lattice structure into unit chips before the disposing the phosphor layer having the phosphors of the lattice structure formed thereon.
10. The method of claim 6 , wherein the phosphors of the lattice structure are arranged in a plurality of dots.
11. The method of claim 6 , wherein the phosphors of the lattice structure have a refractivity greater than a refractivity of the phosphor layer.