Assignment of Assignor's Interest

Recorded: 2008-02-11 Pages: 4

Assignor

MATSUBARA, YOSHIHISA

Executed: 2008-01-18

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same

Application: 12/068,712 →

Publication: US 2008/0197494

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.