Patent Assignment
Reel/Frame 020563/0125
Assignment of Assignor's Interest
Recorded: 2008-02-26
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-0917, JAPAN
Covered Property
(1)
Multilayer Printed Wiring Board