Multilayer printed wiring board
An IC chip for a high frequency region, particularly, a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer is formed at a thickness of 30 μm on a core substrate and a conductive circuit on an interlayer resin insulation layer is formed at a thickness of 15 μm. By thickening the conductive layer, the volume of the conductor itself can be increased thereby decreasing its resistance. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved.
1. A multilayer printed wiring board comprising:
a multilayer core substrate comprising a plurality of insulating layers, a front conductive layer formed on a surface of a front outermost one of the insulating layers, a rear conductive layer formed on a surface of a rear outermost one of the insulating layers, a plurality of inner conductive layers formed between the insulating layers, and a plurality of through holes electrically connecting the front, rear and inner conductive layers;
an interlayer insulation layer formed over the multilayer core substrate;
a conductive layer formed over the interlayer insulating layer and the multilayer core substrate,
wherein one of the front and rear conductive layers comprises one of a power source conductive layer and a grounding conductive layer, the other one of the front and rear conductive layers comprises the other one of the power source and grounding conductive layers, the plurality of inner conductive layers comprises an inner power source conductive layer and an inner grounding conductive layer, the inner power source conductive layer has a thickness which is larger than a thickness of the power source conductive layer, and the inner grounding conductive layer has a thickness which is larger than a thickness of the grounding conductive layer.
2. The multilayer printed wiring board according to claim 1 , wherein a sum of the thicknesses of the power source and inner power source conductive layers in said multilayer core substrate is α1, a thickness of the conductive layer is α2, and a relation between α1 and α2 satisfies α2<α1≦40α2.
3. The multilayer printed wiring board according to claim 1 , wherein a sum of the thicknesses of the grounding and inner grounding conductive layers in said multilayer core substrate is α3, a thickness of the conductive layer is α2, and a relation between α3 and α2 satisfies α2<α3≦40α2.
4. The multilayer printed wiring board according to claim 1 , wherein a sum of the thicknesses of the power source and inner power source conductive layers in said multilayer core substrate is α1, a thickness of the conductive layer is α2, and a relation between α1 and α2 satisfies 1.2α2≦40α2.
5. The multilayer printed wiring board according to claim 1 , wherein a sum of the thicknesses of the grounding and inner grounding conductive layers in said multilayer core substrate layers is α3, a thickness of the conductive layer is α2, and a relation between α3 and α2 satisfies 1.2α2≦≦40α2.
6. The multilayer printed wiring board according to claim 1 , wherein a sum of the thicknesses of the power source and inner power source conductive layers in said multilayer core substrate is α1, a thickness of the conductive layer is α2, a relation between α1 and α2 satisfies α2<α1≦40α2, a sum of the thicknesses of the grounding and inner grounding conductive layers in said multilayer core substrate is α3, and a relation between α3 and α2 satisfies α2<α3≦40α2.
7. The multilayer printed wiring board according to claim 1 , wherein a sum of the thicknesses of the power source and inner power source conductive layers in said multilayer core substrate is α1, a thickness of the conductive layer is α2, a relation between α1 and α2 satisfies 1.2α2≦40α2, a sum of the thicknesses of the grounding and inner grounding conductive layers in said multilayer core substrate is α3, and a relation between α3 and α2 satisfies 1.2α2≦3≦40α2.