Patent Assignment
Reel/Frame 020565/0302
Assignment of Assignor's Interest
Recorded: 2008-02-12
Pages: 3
Assignors
YOO, DO-JAE
Executed: 2007-12-18
KWEON, YOUNG-DO
Executed: 2007-12-18
CHOI, SEOG-MOON
Executed: 2007-12-18
JANG, BUM-SIK
Executed: 2007-12-18
JEONG, TAE-SUNG
Executed: 2007-12-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing Thereof