IP Library › Assignment 020608/0281
Patent Assignment
Reel/Frame 020608/0281

Assignment of Assignor's Interest

Recorded: 2008-02-25 Pages: 3
Assignors
NISHIMURA, TAKAO
Executed: 2007-12-03
NARISAWA, YOSHIAKI
Executed: 2007-12-03
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property (1)
Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
Patent: 8,841,776 →
Application: 12/071,628 →
Publication: US 2008/0150120
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
Assignment of Assignor's Interest Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0469 →