IP Library › Assignment 020680/0171
Patent Assignment
Reel/Frame 020680/0171

Assignment of Assignor's Interest

Recorded: 2008-03-20 Pages: 4
Assignors
DOBRITZ, STEPHAN
Executed: 2008-02-26
HEDLER, HARRY
Executed: 2008-03-10
MIETH, HENNING
Executed: 2008-03-03
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property (1)
Method for Manufacturing a Wafer Level Package
Patent: 7,867,817 →
Application: 12/023,853 →
Publication: US 2009/0194881
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Dec 9, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037254/0782 →