IP Library › Assignment 020697/0072
Patent Assignment
Reel/Frame 020697/0072

Assignment of Assignor's Interest

Recorded: 2008-03-25 Pages: 3
Assignors
CHENG, KANGGUO
Executed: 2008-02-28
RADENS, CARL J
Executed: 2008-03-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Semiconductor Devices Having Tensile and/or Compressive Strain and Methods of Manufacturing and Design Structure
Patent: 7,892,932 →
Application: 12/054,699 →
Publication: US 2009/0246921
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest Feb 24, 2017
From: GLOBALFOUNDRIES INC.
To: AURIGA INNOVATIONS, INC.
Reel/Frame 041804/0940 →