Patent Assignment
Reel/Frame 020702/0911
Assignment of Assignor's Interest
Recorded: 2008-03-26
Pages: 2
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
A Packaging Substrate Structure with a Semiconductor Chip Embedded Therein
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.