Merger

Recorded: 2011-06-30 Pages: 3

Assignor

Executed: 2010-01-08

Assignee

UNIMICRON TECHNOLOGY CORP.

38 HSING PONG RD. KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

A Packaging Substrate Structure with a Semiconductor Chip Embedded Therein

Patent: 8,035,127 →

Application: 12/055,478 →

Publication: US 2008/0237836

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.