Patent Assignment
Reel/Frame 020718/0537
Assignment of Assignor's Interest
Recorded: 2008-03-19
Pages: 2
Assignor
CHIA, KAN-JUNG
Executed: 2008-03-10
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Package Structure in Which Coreless Substrate Has Direct Electrical Connections to Semiconductor Chip and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.