Merger

Recorded: 2011-12-15 Pages: 4

Assignor

Executed: 2010-01-13

Assignee

UNIMICRON TECHNOLOGY CORP.

38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Package Structure in Which Coreless Substrate Has Direct Electrical Connections to Semiconductor Chip and Manufacturing Method Thereof

Patent: 8,058,723 →

Application: 12/076,470 →

Publication: US 2009/0236750

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.