Patent Assignment
Reel/Frame 020721/0001
Assignment of Assignor's Interest
Recorded: 2008-03-19
Pages: 2
Assignor
JOUNG, IL KWEON
Executed: 2008-02-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Mold for Forming Molding Member and Method of Manufacturing Led Package Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.