Patent Assignment
Reel/Frame 024379/0337
Assignment of Assignor's Interest
Recorded: 2010-05-13
Pages: 5
Assignor
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Executed: 2010-04-19
Assignee
SAMSUNG LED CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU,, SUWON, GYUNGGI-DO,, KOREA, REPUBLIC OF
Covered Properties
(5)
Nitride-Based Semiconductor Light Emitting Diode
Nitride semiconductor light emitting diode
Application:
11/797,492 →
Publication:
US 2008/0042161
Dispensing Device Having Mixing Function
Mold for Forming Molding Member and Method of Manufacturing Led Package Using the Same
Apparatus for Forming Nano Pattern and Method for Forming the Nano Pattern Using the Same
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2007
From: HAN, JAE-WOONG; SHIM, JI HYE
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 019326/0022 →
Assignment of Assignor's Interest
May 3, 2007
From: MOON, WON HA; CHOI, CHANG HWAN; HWANG, YOUNG NAM
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 019326/0253 →
Assignment of Assignor's Interest
Mar 19, 2008
From: JOUNG, IL KWEON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 020721/0001 →
Assignment of Assignor's Interest
Mar 19, 2008
From: JOUNG, IL KWEON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 020727/0170 →
Assignment of Assignor's Interest
Jul 23, 2008
From: PARK, MOO YOUN; KIM, JIN HA; HWANG, SOO RYONG; JUNG, IL HYUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 021337/0430 →
Merger
Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →