Mold for forming molding member and method of manufacturing LED package using the same

1. A method of manufacturing a light emitting diode (LED) package, comprising:

preparing a package substrate having an LED chip mounted thereon;

preparing a mold which has a convex portion, a plane portion extending outward from the convex portion, and a projecting portion formed on the lower surface of the plane portion, the projecting portion having a sharp end;

engaging the mold with the package substrate such that the sharp end of the projecting portion is in contact with an upper surface of the package substrate; and

filling transparent resin into the convex portion,

the package substrate and the mold being engaged in such a manner that the package substrate and the sharp end of the projecting portion of the mold come into line contact with each other.

2. The method according to claim 1 , wherein in the preparing of the package substrate, a transparent-resin inlet or air discharge port passing through the package substrate is formed.

3. The method according to claim 2 , wherein in the preparing of the mold, a transparent-resin inlet or air discharge port passing through the convex portion is formed.

4. The method according to claim 1 , wherein in the preparing of the package substrate, a transparent-resin inlet and an air discharge port passing through the package substrate are formed.

5. The method according to claim 1 , wherein in the preparing of the mold, a transparent-resin inlet and an air discharge port passing through the convex portion are formed.

6. A method of manufacturing an LED package, comprising:

preparing a package substrate having an LED chip mounted thereon;

forming a projecting portion which projects from an upper surface of the package substrate and has an outer surface inclined toward the inside;

preparing a mold which has a convex portion and a plane portion extending outward from the convex portion;

engaging the mold with the package substrate such that the mold is contacted with the outer surface of the projecting portion; and

filling transparent resin into the convex portion,

the package substrate and the mold being engaged in such a manner that the projecting portion of the package substrate and the mold come into line contact with each other.

7. The method according to claim 6 , wherein in the preparing of the package substrate, a transparent-resin inlet or air discharge port passing through the package substrate is formed.

8. The method according to claim 7 , wherein in the preparing of the mold, a transparent-resin inlet or air discharge port passing through the convex portion is formed.

9. The method according to claim 6 , wherein in the preparing of the package substrate, a transparent-resin inlet and an air discharge port passing through the package substrate are formed.

10. The method according to claim 6 , wherein in the preparing of the mold, a transparent-resin inlet and an air discharge port passing through the convex portion are formed.

11. A mold for forming a molding member on a package substrate having an LED chip mounted thereon, the mold comprising:

a convex portion;

a plane portion that extends from the convex portion to form a plane surface; and

a projecting portion that projects from the lower surface of the plane portion and has a sharp end,

the sharp end of the projecting portion coming into line contact with an upper surface the package substrate.

12. The mold according to claim 11 , wherein the convex portion has a through-hole passing through the convex portion.

13. The mold according to claim 11 , wherein the convex portion has first and second through-holes passing through the convex portion.

14. The mold according to claim 11 , wherein the projecting portion has first and second surfaces, of which at least one is formed of an inclined surface.

15. The mold according to claim 14 , wherein the first surface forms the outer surface of the projecting portion, and the second surface forms the inner surface of the projecting portion, the second surface extending vertically from the plane portion.

16. The mold according to claim 14 , wherein the first surface forms the outer surface of the projecting portion, and the second surface forms the inner surface of the projecting portion, the first surface extending vertically from the plane portion.

17. The mold according to claim 14 , wherein the first and second surfaces are formed of inclined surfaces of which the ends meet each other.

18. A method of manufacturing an LED package, comprising:

preparing a package substrate having an LED chip mounted thereon;

preparing a mold which has a convex portion and a plane portion;

engaging the mold with the package substrate; and

filling transparent resin into the convex portion such that a hemispheric molding member is formed on the LED chip,

any one of the mold and the package substrate having a projecting portion with a sharp end, and

the package substrate and the mold being engaged in such a manner that the package substrate and the mold come into line contact with each other due to the sharp end of the projection portion.

19. The method according to claim 18 , wherein the preparing of the package substrate includes forming a projecting portion which projects from the surface of the package substrate and has an outer inclined surface to be contacted with the mold.

20. The method according to claim 18 , wherein the preparing of the mold includes forming a projecting portion which projects from the lower surface of the plane portion and has first and second surfaces of which the ends meet each other.

21. The method according to claim 20 , wherein any one of the first and second surfaces is formed of an inclined surface.

22. The method according to claim 21 , wherein the first surface forms the outer surface of the projecting portion, and the second surface forms the inner surface of the projecting portion, the second surface extending vertically from the plane portion.

23. The method according to claim 21 , wherein the first surface forms the outer surface of the projecting portion, and the second surface forms the inner surface of the projecting portion, the first surface extending vertically from the plane portion.

24. The method according to claim 21 , the first and second surfaces are formed of inclined surfaces of which the ends meet each other.

25. The method according to claim 18 further comprising:

separating the mold from the molding member.