Patent Assignment
Reel/Frame 020793/0851
Assignment of Assignor's Interest
Recorded: 2008-04-14
Pages: 6
Assignors
DAUBENSPECK, TIMOTHY H.
Executed: 2008-03-31
GAMBINO, JEFFREY P.
Executed: 2008-03-31
MUZZY, CHRISTOPHER D.
Executed: 2008-04-03
QUESTAD, DAVID L.
Executed: 2008-03-31
SAUTER, WOLFGANG
Executed: 2008-04-01
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Final via Structures for Bond Pad-Solder Ball Interconnections
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest
Feb 24, 2017
From: GLOBALFOUNDRIES INC.
To: AURIGA INNOVATIONS, INC.
Reel/Frame 041804/0940 →