Patent Assignment
Reel/Frame 020844/0246
Assignment of Assignor's Interest
Recorded: 2008-04-23
Pages: 7
Assignors
SUNG, JOON-HO
Executed: 2008-04-14
LEE, JU-YONG
Executed: 2008-04-14
PARK, MI-KYUNG
Executed: 2008-04-14
CHUNG, TAE-YOUNG
Executed: 2008-04-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 000, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Devices Having Contact Plugs in Insulation Layers