Patent Assignment
Reel/Frame 020885/0280
Assignment of Assignor's Interest
Recorded: 2008-05-01
Pages: 3
Assignor
HEDLER, HARRY
Executed: 2008-05-01
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property
(1)
Semiconductor Component with Improved Contact Pad and Method for Forming the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.