IP Library Assignment 020887/0285
Patent Assignment
Reel/Frame 020887/0285

Assignment of Assignor's Interest

Recorded: 2008-05-01 Pages: 2
Assignors
NISHIMURA, TAKAO
Executed: 2008-03-03
KOSAKAI, KAZUNARI
Executed: 2008-03-06
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Resin Sealing Method, Mold for Resin Sealing, and Resin Sealing Apparatus
Application: 12/049,616 →
Publication: US 2008/0230950
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name Sep 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025046/0478 →