IP Library Patent Application 12049616
Patent Application
App. No. 12/049,616

RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APPARATUS

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Quick Facts
Patent No.
US None
App. No.
12/049,616
Abstract

A resin sealing method includes the steps of providing an intermediate mold between an upper mold and a lower mold, the intermediate mold having a cavity forming part where a resin sealed part is received; and introducing sealing resin into the cavity forming part of the intermediate mold and another main surface of the intermediate mold via a runner, the runner being provided in a vicinity of the cavity forming part of the intermediate mold and piercing the intermediate mold in a thickness direction.

Claims (53)

1 . A resin sealing method comprising the steps of:

providing an intermediate mold between an upper mold and a lower mold, the intermediate mold having a cavity forming part where a resin sealed part is received; and

introducing sealing resin into the cavity forming part of the intermediate mold and another main surface of the intermediate mold via a runner, the runner being provided in a vicinity of the cavity forming part of the intermediate mold and piercing the intermediate mold in a thickness direction.

2 . The resin sealing method as claimed in claim 1 ,

wherein a cavity forming part is provided in a surface of the lower mold facing the intermediate mold; and

the resin sealed part is received in the cavity forming part of the lower mold.

3 . The resin sealing method as claimed in claim 1 ,

wherein the cavity forming parts are formed in an upper surface and a lower surface of the intermediate mold.

4 . The resin sealing method as claimed in claim 3 ,

wherein the cavity forming parts formed in the upper surface and the lower surface of the intermediate mold have different configurations.

5 . The resin sealing method as claimed in claim 3 ,

wherein the sealing resin is supplied from a single resin supplying source to the plural cavity forming parts.

6 . The resin sealing method as claimed in claim 3 ,

wherein the sealing resin is independently supplied to the plural cavity forming parts.

7 . The resin sealing method as claimed in claim 1 ,

wherein the intermediate mold is heated at a designated temperature at the time of mold clamping.

8 . A resin sealing method comprising the steps of:

providing a plurality of the intermediate molds between an upper mold and a lower mold, the intermediate molds having cavity forming parts where resin sealed parts are received; and

introducing sealing resin into the cavity forming part of each of the intermediate molds via a runner, the runner being provided in the vicinities of the cavity forming parts of the stacked intermediate molds and piercing the intermediate molds in a stacking direction.

9 . The resin sealing method as claimed in claim 8 ,

wherein the sealing resin is supplied from a single resin supplying source to the plural cavity forming parts.

10 . The resin sealing method as claimed in claim 8 ,

wherein the sealing resin is independently supplied to the plural cavity forming parts.

11 . The resin sealing method as claimed in claim 8 ,

wherein each of the plural cavity forming parts has a different configuration.

12 . A mold for resin sealing, comprising:

an upper mold;

a lower mold; and

at least one intermediate mold provided between the upper mold and the lower mold;

wherein the intermediate mold includes

a cavity forming part formed in at least one of main surfaces of the intermediate mold and configured to receive a resin sealed part; and

a runner provided in the vicinity of the cavity forming part and piercing the intermediate mold in a thickness direction.

13 . The mold for resin sealing as claimed in claim 12 ,

wherein plurality of the intermediate molds are stacked; and

the sealing resin is supplied from a single resin supplying source to plural of the cavity forming parts.

14 . The mold for resin sealing as claimed in claim 12 ,

wherein plural of the intermediate molds are stacked; and

the sealing resin is independently supplied to plural of the cavity forming parts.

15 . The mold for resin sealing as claimed in claim 14 ,

wherein each of plural of the cavity forming parts has a different configuration.

16 . The mold for resin sealing as claimed in claim 12 ,

wherein plural of the cavity forming parts are formed in an upper surface and a lower surface of the intermediate mold.

17 . The mold for resin sealing as claimed in claim 16 ,

wherein plural of the cavity forming parts formed in an upper surface and a lower surface of the intermediate mold have different configurations.

18 . A resin sealing apparatus, comprising:

an upper mold;

a lower mold; and

at least one intermediate mold provided between the upper mold and the lower mold;

wherein the intermediate mold includes

a cavity forming part formed in at least one of main surfaces of the intermediate mold and configured to receive a resin sealed part; and

a runner provided in the vicinity of the cavity forming part and piercing the intermediate mold in a thickness direction.

19 . The resin sealing apparatus as claimed in claim 18 , further comprising:

a heating part configured to heat the intermediate mold at a designated temperature at the time of mold clamping.

Assignments (3)
CHANGE OF NAME Recorded Sep 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025046/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2008
From: NISHIMURA, TAKAO; KOSAKAI, KAZUNARI
To: FUJITSU LIMITED
Reel/Frame 020887/0285 →