Assignment of Assignor's Interest

Recorded: 2008-05-13 Pages: 2

Assignors

MORITA, TOSHIAKI

Executed: 2007-12-25

YASUDA, YUSUKE

Executed: 2007-12-25

IDE, EIICHI

Executed: 2007-12-25

Assignee

HITACHI, LTD.

6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, JAPAN

Covered Property (1)

Semiconductor Device, Manufacturing Method Thereof, Composite Metal Body and Manufacturing Method Thereof

Patent: 8,008,772 →

Application: 12/019,789 →

Publication: US 2008/0237851

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.