IP Library › Assignment 059779/0399
Patent Assignment
Reel/Frame 059779/0399

Nunc Pro Tunc Assignment

Recorded: 2022-04-22 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2022-03-24
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, 319-1221, JAPAN
Covered Properties (3)
Semiconductor Device, Manufacturing Method Thereof, Composite Metal Body and Manufacturing Method Thereof
Patent: 8,008,772 →
Application: 12/019,789 →
Publication: US 2008/0237851
Semiconductor Device and Power Conversion Device Using Same
Application: 15/538,907 →
Publication: US 2017/0352604
Semiconductor Device, Method for Manufacturing Same, and Semiconductor Module
Application: 15/539,447 →
Publication: US 2017/0352648
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2008
From: MORITA, TOSHIAKI; YASUDA, YUSUKE; IDE, EIICHI
To: HITACHI, LTD.
Reel/Frame 020937/0577 →
Assignment of Assignor's Interest Jun 23, 2017
From: HIRAO, TAKASHI; YASUI, KAN; SUZUKI, KAZUHIRO
To: HITACHI, LTD.
Reel/Frame 042797/0209 →
Assignment of Assignor's Interest Jun 23, 2017
From: YASUI, KAN; SUZUKI, KAZUHIRO; TANIGUCHI, TAKAFUMI
To: HITACHI, LTD.
Reel/Frame 042798/0942 →
Change of Name Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →