IP Library Assignment 020954/0140
Patent Assignment
Reel/Frame 020954/0140

Assignment of Assignor's Interest

Recorded: 2008-05-15 Pages: 4
Assignors
BUDD, RUSSELL A.
Executed: 2008-05-13
LIBSCH, FRANK R.
Executed: 2008-05-14
NAH, JAE-WOONG
Executed: 2008-05-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Techniques for Arranging Solder Balls and Forming Bumps
Patent: 7,780,063 →
Application: 12/121,236 →
Publication: US 2009/0283575
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028867/0216 →