Patent Assignment
Reel/Frame 020990/0992
Assignment of Assignor's Interest
Recorded: 2008-05-23
Pages: 2
Assignors
TAKAHASHI, HISATO
Executed: 2008-04-01
TSUKAHARA, HISASHI
Executed: 2008-04-01
TOMITA, KYOUICHI
Executed: 2008-04-01
HAGIWARA, SHINSUKE
Executed: 2008-04-01
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Liquid Resin Composition for Electronic Components and Electronic Component Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →