IP Library › Assignment 021005/0108
Patent Assignment
Reel/Frame 021005/0108

Assignment of Assignor's Interest

Recorded: 2008-05-27 Pages: 7
Assignors
HEDLER, HARRY
Executed: 2008-05-05
IRSIGLER, ROLAND
Executed: 2008-05-08
WEIS, ROLF
Executed: 2008-05-16
WEBER, DETLEF
Executed: 2008-05-16
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property (1)
Reduced-Stress Through-Chip Feature and Method of Making the Same
Patent: 8,106,511 →
Application: 12/039,232 →
Publication: US 2009/0218690
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Dec 9, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037254/0782 →