Patent Assignment
Reel/Frame 021020/0615
Assignment of Assignor's Interest
Recorded: 2008-05-27
Pages: 6
Assignors
HIRANO, NAOHIKO
Executed: 2008-04-22
TANAHASHI, AKIRA
Executed: 2008-04-22
SAKAMOTO, YOSHITSUGU
Executed: 2008-04-22
TSURUTA, KAICHI
Executed: 2008-04-21
ISHII, TAKASHI
Executed: 2008-04-21
SOGA, SATOSHI
Executed: 2008-04-21
Assignees
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO 120-8555, JAPAN
DENSO CORPORATION
1-1 SHOWA-CHO, KARIYA-SHI, AICHI 448-8661, JAPAN
Covered Property
(1)
Solder Preform and a Process for Its Manufacture