Solder preform and a process for its manufacture
View Patent ↗A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.
1. A process for manufacturing a solder preform comprising the steps of:
(1) mixing high melting point metal particles with a pyrolyzable liquid flux to obtain a mixture;
(2) charging the mixture into molten solder at a temperature lower than the melting point of the high melting point metal particles followed by stirring to prepare a mixed mother alloy in which the high melting point particles are dispersed;
(3) charging the mixed mother alloy into molten solder at a temperature lower than the melting point of the high melting point metal particles followed by stirring and casting into a mold to prepare a billet;
(4) forming the billet into a member suitable for punching; and
(5) punching the member to form a solder preform containing the high melting point metal particles dispersed in a solder alloy matrix phase.
2. A process for manufacturing a solder preform as claimed in claim 1 wherein forming the billet into a member suitable for punching includes extruding the billet.
3. A process for manufacturing a solder preform as claimed in claim 1 wherein forming the billet into a member suitable for punching includes rolling.
4. A process for manufacturing a solder preform as claimed in claim 1 wherein the pyrolyzable liquid flux is a flux which has a weight loss of at least 80% at 285° C. on a heating weight loss curve measured by thermogravimetry.
5. A process for manufacturing a solder preform as claimed in claim 1 wherein the molten solder is subjected to vacuum treatment in at least one of the step of preparing a mixed mother alloy and the step of preparing a billet.
6. A process for manufacturing a solder preform as claimed in claim 1 wherein the high melting point metal particles are Ni particles.
7. A process for manufacturing a solder preform as claimed in claim 1 wherein the high melting point metal particles have a diameter of at least 20 μm.
8. A process for manufacturing a solder preform as claimed in claim 1 including completely decomposing the flux prior to the casting.
9. A process for manufacturing a solder preform as claimed in claim 1 wherein the high melting point metal particles have a diameter of at most 90% of a thickness of the preform.
10. A process for manufacturing a solder preform as claimed in claim 1 including solidifying the mixed mother alloy to obtain a mixed mother alloy having high melting point metal particles with a particle diameter of at least 20 μm dispersed therein.
11. A process for manufacturing a solder preform as claimed in claim 1 wherein the mixed mother alloy comprises an alloy matrix phase and unmelted metal particles with a particle diameter of at least 20 μm uniformly dispersed in the matrix phase.
12. A process for manufacturing a solder preform as claimed in claim 1 wherein the high melting point metal particles are dispersed in the solder preform, and the high melting point metal particles in the solder preform have a particle diameter of at least 20 μm.
13. A process as claimed in claim 12 wherein the high melting point metal particles in the solder preform have a particle diameter of 40-300 μm.
14. A process for manufacturing a solder preform as claimed in claim 1 wherein the molten solder into which the mixture is charged comprises an Ni-containing solder alloy.
15. A process for manufacturing a solder preform comprising the steps of:
(1) mixing high melting point metal particles with a pyrolyzable liquid flux to obtain a mixture;
(2) charging the mixture into molten solder at a temperature lower than the melting point of the high melting point metal particles followed by stirring and rapid cooling of the molten solder to obtain a mixed mother alloy in which the high melting point metal particles are dispersed;
(3) preparing a billet by charging the mixed mother alloy into molten solder at a temperature lower than the melting point of the high melting point metal particles followed by stirring, casting into a mold, and rapid cooling of the molten solder;
(4) extruding the billet with an extruder to form a strip;
(5) rolling the strip in a rolling mill to form a ribbon which is thinner than the strip; and
(6) punching the ribbon to a predetermined shape to form a solder preform containing the high melting point metal particles.
16. A process for manufacturing a solder member comprising:
mixing high melting point metal particles having a′particle diameter of at least 20 μm with a pyrolyzable liquid flux to obtain a mixture;
charging the mixture into molten solder comprising a solder alloy having a lower melting temperature than the high melting point metal particles and stirring to prepare a mixed mother alloy in which unmelted high melting point metal particles are dispersed;
charging the mixed mother alloy into molten solder, stirring, casting, and solidifying to obtain a cast member comprising a solder alloy matrix phase and high melting point metal particles having a higher melting point than the matrix phase and having a particle diameter of at least 20 μm dispersed in the matrix phase; and
shaping the cast member.
17. A process as claimed in claim 16 wherein shaping the cast member includes punching the cast member to form a preform.
18. A process as claimed in claim 16 wherein shaping the cast member includes wire drawing.
19. A process as claimed in claim 16 wherein the high melting point metal particles in the matrix phase have a particle diameter of 40-300 μm.