IP Library › Assignment 021036/0887
Patent Assignment
Reel/Frame 021036/0887

Assignment of Assignor's Interest

Recorded: 2008-06-04 Pages: 2
Assignor
NAKAGAWA, SEIJI
Executed: 2008-05-29
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
9775 TOLEDO WAY, IRVINE, CALIFORNIA, 92618
Covered Property (1)
Oven for Semiconductor Wafer
Patent: 8,073,316 →
Application: 12/023,344 →
Publication: US 2009/0196588
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 28, 2010
From: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 024603/0939 →
Assignment of Assignor's Interest Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
Change of Name and Address Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
Merger Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →