Patent Assignment
Reel/Frame 024603/0939
Assignment of Assignor's Interest
Recorded: 2010-06-28
Pages: 2
Assignor
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Executed: 2010-06-05
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1 SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Oven for Semiconductor Wafer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 4, 2008
From: NAKAGAWA, SEIJI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 021036/0887 →
Assignment of Assignor's Interest
Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
Change of Name and Address
Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
Merger
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →