IP Library Assignment 021063/0079
Patent Assignment
Reel/Frame 021063/0079

Corrective Assignment to Correct Order of the Third and Fourth Assignors, Previously Recorded at Reel 019441, Frame 0224.

Recorded: 2008-06-05 Pages: 5
Assignors
SHIMADA, TOMOHARU
Executed: 2007-06-08
MOROHASHI, AKIRA
Executed: 2007-06-21
YOKOZAWA, KOJIRO
Executed: 2007-05-21
YAMAZAKI, KEISHIN
Executed: 2007-05-28
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Heat Treatment Apparatus and Method of Manufacturing Substrates
Patent: 8,963,051 →
Application: 11/662,573 →
Publication: US 2008/0190910
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 14, 2007
From: SHIMADA, TOMOHARU; MOROHASHI, AKIRA; YAMAZAKI, KEISHIN; YOKOZAWA, KOJIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 019441/0224 →
Record to Correct Doc Dates of the Third and Fourt Jun 10, 2008
From: SHIMADA, TOMOHARU; MOROHASHI, AKIRA; YAMAZAKI, KEISHIN; YOKOZAWA, KOJIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 021077/0931 →
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →