Patent Assignment
Reel/Frame 021074/0790
Assignment of Assignor's Interest
Recorded: 2008-06-10
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Thermally Dissipating Dummy Pads