IP Library Assignment 021100/0821
Patent Assignment
Reel/Frame 021100/0821

Assignment of Assignor's Interest

Recorded: 2008-06-16 Pages: 2
Assignor
OTSUKI, KAZUTAKA
Executed: 2008-05-19
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Method of Evaluating Thermal Stress Resistance of Semiconductor Device, and Semiconductor Wafer Having Test Element
Patent: 7,642,625 →
Application: 12/139,717 →
Publication: US 2008/0308800
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0696 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →