Assignment of Assignor's Interest

Recorded: 2008-06-17 Pages: 4

Assignor

SASAKI, DAI

Executed: 2008-06-13

Assignee

ELPIDA MEMORY, INC.

2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN

Covered Property (1)

Implementation structure of semiconductor package

Application: 12/213,280 →

Publication: US 2008/0308314

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.