Patent Assignment
Reel/Frame 021171/0153
Assignment of Assignor's Interest
Recorded: 2008-06-30
Pages: 3
Assignors
MIYABE, SHINSUKE
Executed: 2008-05-12
MAEJIMA, KUNIAKI
Executed: 2008-05-12
IZUMI, MASAHIRO
Executed: 2008-05-12
TANAKA, HIROAKI
Executed: 2008-05-14
Assignees
NIPPON CHEMICAL INDUSTRIAL CO., LTD.
11-1, KAMEIDO 9-CHOME, KOTO-KU, TOKYO, JAPAN
SPEEDFAM CO., LTD.
2647 HAYAKAWA, AYASE-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Polishing Composition for Semiconductor Wafer, Method for Production Thereof and Polishing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.