Assignment of Assignor's Interest

Recorded: 2010-05-19 Pages: 3

Assignor

SPEEDFAM CO., LTD.

Executed: 2010-05-12

Assignee

NIPPON CHEMICAL INDUSTRIAL CO.

11-1, KAMEIDO 9-CHOME, KOTO-KU, TOKYO, 136-8515, JAPAN

Covered Property (1)

Polishing Composition for Semiconductor Wafer, Method for Production Thereof and Polishing Method

Patent: 7,753,974 →

Application: 12/153,111 →

Publication: US 2008/0287038

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.