Patent Assignment
Reel/Frame 021186/0603
Assignment of Assignor's Interest
Recorded: 2008-06-23
Pages: 3
Assignors
PARK, KWANG SOO
Executed: 2008-05-19
CHONG, MYUNG GUN
Executed: 2008-05-19
YANG, DEK GIN
Executed: 2008-05-19
BYUN, DAE JUNG
Executed: 2008-05-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing an Embedded Printed Circuit Board