Assignment of Assignor's Interest

Recorded: 2008-07-15 Pages: 6

Assignors

CHANDRA, RAJIT

Executed: 2008-06-17

SHU, JOHN YANJIANG

Executed: 2008-06-17

SRINIVASAN, ADI

Executed: 2008-06-17

CARNEVALI, PAOLO

Executed: 2008-06-20

Assignee

GRADIENT DESIGN AUTOMATION, INC.

4633 OLD IRONSIDES DRIVE, SUITE 200, SANTA CLARA, CALIFORNIA, 95054

Covered Properties (2)

Thermal Simulation Using Adaptive 3D and Hierarchical Grid Mechanisms

Patent: 8,286,111 →

Application: 12/131,821 →

Publication: US 2009/0024347

Simulation of IC Temperature Distributions Using a Hierarchical Grid

Application: 60/941,660 →