Patent Application
Provisional
Small
App. No. 60/941,660
· Confirmation No. 2574
Simulation of IC Temperature Distributions Using a Hierarchical Grid
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-06-15 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-06-02 | ADS |
Application Data Sheet | 5 | View | |
| 2007-06-02 | SPEC |
Specification | 23 | View | |
| 2007-06-02 | APPENDIX |
Appendix to the specification | 119 | View | |
| 2007-06-02 | APPENDIX |
Appendix to the specification | 42 | View | |
| 2007-06-02 | CLM |
Claims | 2 | View | |
| 2007-06-02 | ABST |
Abstract | 1 | View | |
| 2007-06-02 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2007-06-02 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-06-02 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Rajit Chandra
Cupertino, CA
Paolo Carnevali
San Jose, CA
John Shu
Livermore, CA
Adi Srinivasan
Fremont, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 23339
- Docket No.
- GDA-2007-02
- Confirmation No.
- 2574
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-07-15
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Quick Facts
- App. No.
- 60/941,660
- Filed
- 2007-06-02
External Links