Patent Assignment
Reel/Frame 021314/0185
Assignment of Assignor's Interest
Recorded: 2008-07-30
Pages: 2
Assignors
FUKASAWA, MASATO
Executed: 2008-05-16
ENOMOTO, KAZUHIRO
Executed: 2008-05-16
YAMAGISHI, CHIAKI
Executed: 2008-05-16
KOYAMA, NAOYUKI
Executed: 2008-05-16
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, JAPAN
Covered Property
(1)
Cmp Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address of Assignee
Jun 6, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 030573/0211 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →