Patent Assignment
Reel/Frame 030573/0211
Change of Address of Assignee
Recorded: 2013-06-06
Pages: 3
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-06-06
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Cmp Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 30, 2008
From: FUKASAWA, MASATO; ENOMOTO, KAZUHIRO; YAMAGISHI, CHIAKI; KOYAMA, NAOYUKI
To: HITACHI CHEMICAL CO., LTD.
Reel/Frame 021314/0185 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →