Patent Assignment
Reel/Frame 021321/0323
Assignment of Assignor's Interest
Recorded: 2008-07-18
Pages: 2
Assignors
AHN, EUN-CHUL
Executed: 2008-06-18
O, MIN-HO
Executed: 2008-06-20
LEE, JONG HO
Executed: 2008-06-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Embedded in Substrate, System Including the Same and Associated Methods