IP Library › Assignment 021350/0188
Patent Assignment
Reel/Frame 021350/0188

Assignment of Assignor's Interest

Recorded: 2008-08-06 Pages: 3
Assignors
HEDLER, HARRY
Executed: 2008-08-01
IRSIGLER, ROLAND
Executed: 2008-08-01
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property (1)
Method for Manufacturing a Multichip Module Assembly
Patent: 7,847,415 →
Application: 12/175,726 →
Publication: US 2010/0013101
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Sep 9, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036575/0670 →