Patent Assignment
Reel/Frame 021352/0752
Assignment of Assignor's Interest
Recorded: 2008-08-07
Pages: 4
Assignors
KOLAN, RAVI KANTH
Executed: 2008-07-17
YI-SHENG, ANTHONY SUN
Executed: 2008-07-17
HAO07, LIU
Executed: 2008-07-17
HOCK, TOH CHIN
Executed: 2008-07-17
Assignee
UNITED TEST AND ASSEMBLY CENTER. LTD.
5 SERANGOON NORTH AVENUE 5, SINGAPORE, 554916, SINGAPORE
Covered Property
(1)
Stacked Die Semiconductor Package and Method of Assembly
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →