Patent Assignment
Reel/Frame 021407/0790
Assignment of Assignor's Interest
Recorded: 2008-08-07
Pages: 2
Assignor
HSU, SHIH-PING
Executed: 2008-08-04
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Packaging Substrate Structure with Electronic Components Embedded Therein and Method for Manufacturing the Same