Packaging substrate structure with electronic components embedded therein and method for manufacturing the same
A packaging substrate structure with electronic components embedded therein and a method for manufacturing the same are disclosed. The packaging substrate structure comprises: a core board; a built-up structure disposed on at least one surface of the core board, wherein the built-up structure has a plurality of conductive pads and an electronic component-disposing part on the surface thereof; a solder mask disposed on the surface of the built-up structure, where the solder mask has a open area to expose the electronic component-disposing part and a plurality of openings to expose the conductive pads of the built-up structure; and an electronic component disposed on the electronic component-disposing part and in the open area. Accordingly, the packaging substrate disclosed by the present invention exhibits enhanced electrical performance and product reliability.
1. A method for manufacturing a packaging substrate structure with electronic components embedded therein, comprising:
providing a core board;
forming a built-up structure on at least one surface of the core board, wherein the built-up structure comprises at least one dielectric layer, at least one wiring layer stacked on the dielectric layer, and a plurality of conductive vias electrically connecting to the wiring layer, the built-up structure has an electronic component-disposing part on the surface thereof, and the outmost wiring layer of the built-up structure has a plurality of conductive pads and a metal block on the electronic component-disposing part;
forming a solder mask on the surface of the built-up structure, wherein a plurality of openings are formed in the solder mask to expose the conductive pads of the built-up structure, also a first open area is formed in the solder mask to expose the metal block, and a second open area is formed by etching the metal block; and
placing an electronic component in the first and second open areas, wherein the electronic component has an active surface and an inactive surface, the active surface has a plurality of electrode pads, and the inactive surface faces the electronic component-disposing part of the built-up structure.
2. The method as claimed in claim 1 , wherein the exposed part of the metal block is etched to form the second open area while the unexposed part of the metal block is used as a heat sink around the second open area.
3. The method as claimed in claim 1 , wherein the inactive surface of the electronic component is attached to the electronic component-disposing part of the built-up structure through an adhesive layer.
4. The method as claimed in claim 1 , further comprising filling a gap between the first and second open areas and the electronic component with an adhesive material to fix the electronic component.