Patent Assignment
Reel/Frame 021420/0180
Assignment of Assignor's Interest
Recorded: 2008-08-21
Pages: 4
Assignor
JUNG, OH-JIN
Executed: 2008-08-19
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Method of Fabricating the Same and Stacked Package Having the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.