IP Library Assignment 021431/0565
Patent Assignment
Reel/Frame 021431/0565

Assignment of Assignor's Interest

Recorded: 2008-08-22 Pages: 4
Assignors
KASAI, JUNICHI
Executed: 2008-07-29
TANAKA, JUNJI
Executed: 2008-08-04
MASUDA, NAOMI
Executed: 2008-07-26
Assignee
SPANSION LLC
915 DEGUIGNE DRIVE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088
Covered Property (1)
Structure, Method and System for Assessing Bonding of Electrodes in Fcb Packaging
Patent: 7,816,788 →
Application: 12/122,556 →
Publication: US 2008/0303144
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036042/0212 →
Partial Release of Security Interest in Patents Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
Assignment of Assignor's Interest Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst. Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →