Patent Assignment
Reel/Frame 021474/0295
Assignment of Assignor's Interest
Recorded: 2008-09-03
Pages: 3
Assignee
SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
SUNGKYUNKWAN UNIVERSITY, 300, CHEONCHEON-DONG, JANGAN-GU, SUWON, KOREA, REPUBLIC OF
Covered Property
(1)
Flip Chip for Electrical Function Test and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.